COMSOL Day: MEMS
See what is possible with multiphysics simulation
Join fellow engineers and simulation specialists to learn about multiphysics simulations in applications that involve microsystem devices. Topics will cover modeling MEMS-based sensors and actuators, as well as optic, microacoustic, and piezoelectric devices.
We welcome both experienced COMSOL Multiphysics® users and those who are new to the COMSOL® software to attend COMSOL Day. The sessions will focus on modeling techniques in the respective application areas, and you will learn about the software features and best practices from applications engineers. Keynote speakers from industries based on or reliant on such devices will provide perspective on the importance of simulation to these applications.
View our schedule below and register for free today!
Modeling real-world MEMS devices and processes is only possible if multiphysics interactions are included. At small length scales, the design of resonators, gyroscopes, accelerometers, microspeakers, microphones, and actuators must consider the effects of multiple physical phenomena in their operation. These include, for example, electromagnetic-structure, thermostructure, and fluid-structure interactions, as well as damping effects. Numerous simulation users from the MEMS industry therefore use multiphysics simulation as a key element in their product development process.
During this session, the latest trend in modeling the behavior of MEMS components and applications will be investigated: You will learn how simulation specialists make their complex and high-fidelity multiphysics models available for other departments and for their customers.
Surface Chemical Reactions Simulated in Microfluidic Systems for the Photodegradation of Micropollutants in Wastewater
Advanced oxidation processes (AOPs) for wastewater treatment are efficient methods for the removal of emerging pollutants, such as dissolved chemicals and drugs. Among AOPs, heterogeneous photocatalysis arises as a promising technology, with TiO2 as the most widely studied and efficient photocatalyst. One of the challenges lies in the treatment of large volumes, where light is rapidly blocked, thus hindering TiO2’s function. With microfluidics, the liquid is encased in microchannels, removing this volume issue. Microfluidics is an emerging branch of science that generated significant attention for its potential application to a wide range of fields over the last few decades. Microfluidic devices possess great characteristics, such as laminar flow regime, large surface area to volume ratio, and less mass transfer limitation due to the small volume and fine flow control. Nevertheless, inside these small-sized microchannels, where the fluids circulate, the space time or residence time is also small and the fluids’ velocity is high for foreseeing slow reactions to happen herein. In our position, we combine the photocatalysis and microfluidics, and prototype a smart microfluidic energy architecture. The simulation work done by deploying COMSOL Multiphysics® has demonstrated a very satisfying treatment efficiency so far.
Modeling piezoelectric devices requires a multiphysics approach, where incorporating such models within the design process requires a better understanding of the interactions between structural materials, piezoelectric ceramics, and fluid damping. A more accurate solution for all involved physics reduces development time and prototyping costs. Join this session to gain insight into the most important simulation techniques when it comes to modeling piezoelectric devices.
Meshing microscopic geometries for the purpose of simulation can be challenging for several reasons. For example, widely different mesh sizes may be advantageous or even required from modeling domain to modeling domain. Alternatively, large directional dependencies on mesh accuracy, due to dimensional requirements or anisotropic behavior of the material parameters, need to be accounted for. Join this Tech Café to discuss the challenges of meshing MEMS and other microsystem devices with colleagues, while receiving useful tips from COMSOL technical staff.
Acoustic propagation in structures with submillimeter physical features is common in the components of consumer products like mobile devices, protective grills of loudspeakers, hearing aids, and perforates used in mufflers and sound insulation. To model this accurately, you need to include thermoviscous losses in your definition of the physics. In this session, you will be introduced to modeling techniques used to capture these effects and how to model nonlinear effects in microacoustics systems.
MEMS devices are designed and built in many configurations for a wide range of applications.
One fundamental aspect in the design of such devices is the use and manipulation of different materials. While smart materials such as piezoelectric, piezoresistive, shape memory alloy, and other materials are commonly used, some MEMS devices also incorporate engineered materials such as metamaterials, which exhibit unique electromagnetic or acoustic behavior.
Learn more about the implementation of various special material properties and discuss best practices with interested colleagues in this tech café.
Simulating MEMS Loudspeakers
The simulation of classic loudspeakers covers several physical domains, ranging from the electrical drive over the vibrating mechanics to the acoustic coupling. But what does it look like for MEMS loudspeakers? Their new drive mechanisms in combination with their comparatively small sizes lead to additional challenges. Here, we are going to take a closer look at the modeling of microacoustics, considering thermoviscous effects and meshing the geometry down to submicrometer sizes, in particular.
COMSOL Multiphysics® and the add-on MEMS Module contain all of the modeling components and features necessary for analyzing the combined mechanical and electrical behavior in devices on the microscale. This session will introduce the MEMS Module by summarizing its features and demonstrating examples that analyze MEMS-based sensors, actuators, and filters.
Viscous and thermal damping effects play a significant role in electrical, mechanical, and acoustic behavior at the dimension level of microsystems. This is inherently the case for MEMS devices. In this Tech Café, we will discuss the various damping processes when modeling such systems with colleagues and COMSOL engineers.
MEMS devices for measuring acceleration or orientation in space usually rely on the interaction between electrical and mechanical phenomena. As a consequence, a multiphysics approach often proves necessary to accurately model them. This session will demonstrate how COMSOL Multiphysics® allows you to easily set up such electromechanical models using built-in features in the software.
Scattering parameters, or S-parameters, are important targets for numerous simulation studies in electronic device development. In this Tech Café, we will discuss and demonstrate various methods of extracting S-parameters from microscale capacitive and inductive devices. In particular, an interdigitated capacitor example will be available to be modeled in 3D to start the discussion. This can be modeled using three different approaches and then simplified to 2D. These techniques can also be applied to other devices, such as SAW sensors, RF MEMS switches, resonators, and filters.
Technology Manager, Acoustics
Principal Applications Engineer
Lead Applications Engineer
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