Modeling Heat Transfer in Thin Layers in 18 Minutes

May 19, 202011:30 AM - 11:48 AM EDT

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Discover how to model heat transfer in layered structures with the Heat Transfer Module, an add-on to COMSOL Multiphysics®.

In this webinar, we will give an overview of the layered structure modeling capabilities. It covers simple to advanced layered structures that are usually too thin to be explicitly represented in the geometry. We will present several topics, including:

  • Preprocessing tools to define and visualize layer thickness, orientation, and material properties
  • Definition heat sources, fluxes, temperature constraints, and multiphysics couplings
  • Dedicated postprocessing features, like volume, surface, and through-thickness plots

There will also be a live demonstration of these tools for both existing and new users of COMSOL Multiphysics®.

Register for Modeling Heat Transfer in Thin Layers in 18 Minutes

May 19, 2020 11:30 AM - 11:48 AM EDT
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Webinar Details

Date and Time

May 19, 2020 | 11:30 AM EDT (UTC-04:00)

Speaker

Nicolas Huc
COMSOL

Nicolas Huc joined COMSOL France in 2004 and is currently the head of their development team. He is also the manager of the Heat Transfer Module. Nicolas studied engineering at ENSIMAG before receiving his PhD in living system modeling from Joseph Fourier University.