Chemical Etching

Application ID: 44481


This example illustrates the principle of wet chemical etching for 2D geometry under laminar flow. The purpose of this tutorial is to examine how the copper substrate material is depleted and how the cavity shape evolves during the wet etching process. Wet chemical etching is particularly important for microelectronics industry for patterning of integrated circuit, MEMS devices, optoelectronic and pressure sensors. Wet etching processes use solution based (“wet”) etchants, where the substrate to be etched is immersed in a controlled flow of etchant.

This model example illustrates applications of this type that would nominally be built using the following products:

COMSOL Multiphysics®