Design of Cooling System for Electronic Devices Using Impinging JetsP. Lin, C. Chang, H. Huang, and B. Zheng
Mechanical and Aerospace Eng., Rutgers, The State University of New Jersey, Piscataway, NJ
FTR Systems (Shanghai) Inc., Shanghai, China
PolarOnyx, Inc., San Jose, CA
School of Mechatronics Eng., University of Electronic Science and Technology of China, Chengdu, China
The heat sink designs using impinging liquid jets, which form stagnation flows, feature uniform heat transfer coefficients, and provide thin thermal boundary layers, are studied to reduce the heat from GPUs. Three different designs using central, micro, and uniform-cross-section (UCS) central jets are studied and simulated in COMSOL.
The efficiency factors, defined as the ratio of total removed energy over inlet pumping energy, are measured to quantitatively represent the heat transfer performances. The central and micro jet designs consume smaller amounts of pumping powers but form vortexes and thicker thermal boundary layers near the outlets. The UCS central jet design not only avoids the vortex formations but also maintains the thermal boundary layer thickness; therefore, higher efficiency has been achieved.