See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
COMSOL Multiphysics® Enhances Design Process at e2v technologies
Outline of presentation: We have seen a few of the diverse ways e2v has started to use COMSOL It is allowing us to view our processes in a different way Resulting in improvements It is enabling our engineers and scientists to examine the full application, not just the microwave or RF ... Read More
Phasefield Modeling of Ferroelectric Materials
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Read More
COMSOL Multiphysics® Version 4
Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology. Read More
Oxidation of Metallic Nanoparticles
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Read More
Simulation of Daisy Chain Flip-Chip Interconnections
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Read More
Modelling of Micro/Macro Densification Phenomena of Cu Powder during Capacitor Discharge Sintering
Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Read More
Modelling of SiC Chemical Vapour Infiltration Process Assisted by Microwave Heating
The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Read More
Numerical Simulation of Pulsed TIG Welding Partial and Full Penetration
In this poster, a numerical model of spot pulsed current TIG welding for partially and fully penetrated weld pools is presented. Heat transfer and fluid flow in the weld pool driven by the combination of electromagnetic force, buoyancy force, surface tension gradient and latent heat are ... Read More
Streamer Propagation in a Point-to-Plane Geometry
Corona discharge is used in several applications such as surface treatment of polymers, photocopying or dust removal in air conditioning. Streamer formation is undesirable for most of these applications. Therefore, several studies have been dedicated to investigate the formation and ... Read More
Coupled Magnetic-Structural Finite Element Analysis
In general, there is a wide range of applications requiring coupled electromagneticstructural analysis. In this paper, two of such coupled problems have been analyzed. The first one is a transient analysis of Electromagnetic Forming process and the other problem is a deformation analysis ... Read More