Here you will find presentations given at COMSOL Conferences around the globe. The presentations explore the innovative research and products designed by your peers using COMSOL Multiphysics. Research topics span a wide array of industries and application areas, including the electrical, mechanical, fluid, and chemical disciplines. Use the Quick Search to find presentations pertaining to your application area.

Designing Materials for Mechanical Invisibility Cloaks

P. Olsson[1], F. Larsson[1], A. Khlopotin[1], S. Razanica[1]
[1]Chalmers University of Technology, Gothenburg, Sweden

In solid mechanics, there is considerable interest in achieving “invisibility”. The applications in mechanics include protection of structures and parts of structures from potentially harmful transient waves and steady state vibrations. A suggested large scale application is that protection against seismic waves from earthquakes could be achieved by using cloaking to re-route the waves around ...

Prediction of Magnetic Fields, Eddy Currents, and Loads in a Tokamak During a Disruption for Alcator C-Mod's Advanced Outer Divertor - new

J. Doody[1], B. Lipschultz[2], R. Granetz[1], W. Beck[1], L. Zhou[1], J. Irby[1]
[1]Massachusetts Institute of Technology, Plasma Science and Fusion Center, Cambridge, MA, USA
[2]York Plasma Institute, University of York, Heslington, York, UK

COMSOL Multiphysics® has been used to predict the magnetic fields, eddy current, lorenz forces and stresses during a disruption for the new Advanced Outer Divertor for the Alcator C-Mod tokamak. A tokamak is used to study magnetic confinement of plasma for fusion, and a disruption occurs when the plasma decays, rapidly losing all of its current. COMSOL has been used to recreate the fields ...

Modeling and Simulation of High Sensitivity CMOS Pressure Sensor Using Free Boundary Circular Diaphragm Embedded on Ring Channel Shaped MOSFET

S. Joy[1], T. Tom[1]
[1]Rajagiri School of Engineering and Technology, Kochi, Kerala, India

Sensors have diverse applications ranging from medical field to space explorations. They convert physical parameters such as temperature, pressure, humidity etc: - into an electrical output. The discovery of piezoresistivity property of silicon and germanium led to miniaturization of pressure sensors. Improvement in the sensitivity is the major factor to be considered while designing pressure ...

Residual Stress in the Silicon Membrane of Circular CMUT

A. T. Galisultanov [1], P. Le Moal [1], V. Walter [1], G. Bourbon [1],
[1] FEMTO-ST, Besanson, France

During last twenty years capacitive micromachined ultrasonic transducers (CMUT) have been developed extremely fast [1-2]. CMUT is an attractive alternative to traditional piezoelectric transducer, which converts electrical signal to mechanical vibration and vice versa. The main advantages of CMUT compared to most common solution: wide bandwidth (improved image resolution) and compatibility with ...

A Finite Element Model For Structural And Aeroelastic Analysis Of Rotary Wings With Advanced Blade Geometry

E. Piccione, G. Bernardini, and M. Gennaretti
University Roma Tre Dept. of Mechanical and Industrial Engineering, Via della Vasca Navale, Rome, Italy

Objective of this paper is the development and implementation of a finite element model, in a COMSOL Multiphysics context, for the prediction of the aeroelastic behavior of rotor blades. In particular, the attention is focused on new generation blades characterized by curved elastic axes, with the presence of tip sweep and anhedral angles. The blade structural model implemented is based on ...

Dielectric Adaptive Optical Gels

R. Eisenschmid [1],
[1] OPTIMA pharma GmbH, Schwäbisch Hall, Germany

Adaptive Optics is common sense, since many people use digital cameras with electromechanical iris actors on elastic autofocus lenses. This project tries to create a COMSOL Multiphysics based mathematical model of adaptive optics with electrostatically induced deformation of dielectric gels. Upper and lower sides of a lens (dielectric conductive gel) are coated by transparent conductive films, i ...

Design and Analysis of Microcantilevers for Sensor Applications

R. Phadke [1], R. Pramodhini [1], A. Tiwari [2],
[1] Nitte Meenakshi Institute of Technology, Bengaluru, Karnataka, India

In this report, we present the design and analysis of microcantilevers of various shapes and materials for different applications. Here we investigate the sensitivity i.e. amount of bending of the cantilever due to same amount of force applied to each of the shape and the respective material using COMSOL Multiphysics software. In this context, we are restricted to the use of microcantilevers in ...

Fatigue Damage Evaluation on Mechanical Components under Multiaxial Loadings

R. Tovo[1] and S. Capetta[1]
[1]Dipartimento di Ingegneria, Università degli Studi di Ferrara, Ferrara, Italy

This paper is concerned with the fatigue behavior of complex, three-dimensional, stress concentrations under multiaxial loadings. Starting from the stress field obtained from a linear elastic analysis and taking advantage of the so-called implicit gradient approximation, an effective stress index connected with the material strength is calculated. Besides, this work summarizes a first ...

A Numerical Study for Rubber Particles Collection Involved in New Thermoforming Composite Process Using COMSOL Multiphysics®

R. Carbone[1], V. Antonelli[2][3], A. Langella[1], and R. Marissen[3]

[1]Material and Production Engineering Department, Università degli Studi di Napoli Federico II, Napoli, Italy
[2]Institute of Lightweight Structures, Technische Universität München, München, Germany
[3]Design and Production of Composite Structure, Delft University of Technology, Delft, The Netherlands

This paper deal of the forming process applied to the thermoplastic composites. A new thermoforming process that uses rubber particles collection as flexible mould was presented and numerically modeled. A characterization of the rubber in particles form was previously performed to value the material parameters in the user-defined hyperelastic constitutive laws employed in the FEM (Finite Element ...

Evaluation of Low-Cycle-Fatigue Life of Solder Joints in Surface Mounting Power Devices by Finite Element Modeling

N. Delmonte[1], F. Giuliani[1], M. Bernardoni[2], P. Cova[1]
[1]Dipartimento di Ingegneria dell'Informazione, Università degli Studi di Parma, Parma, Italy
[2]CDTR - Centre for Device Thermography and Reliability, H. H. Wills Dept. of Physics, University of Bristol, Bristol, United Kingdom

The reliability of solder joints [1,2] is one of the key factors in the determination of the reliability of the high power density electronic converters, being the solder joints both the mechanical, the electrical, and often the thermal connections between the electronic component and the board in which the component is placed. The main mechanism by which solder joints are damaged is thermal ...