Pulse Reverse Plating

Application ID: 61601

This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal surface can be created.

The model assumes that a quasi-stationary current distribution establishes quickly during each pulse, so that an average of the forward and reverse deposition rates can be used in the time-dependent deforming geometry simulation.

This model example illustrates applications of this type that would nominally be built using the following products:

Electrodeposition Module