Pulse Reverse Plating
Application ID: 61601
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal surface can be created.
The model assumes that a quasi-stationary current distribution establishes quickly during each pulse, so that an average of the forward and reverse deposition rates can be used in the time-dependent deforming geometry simulation.
This model example illustrates applications of this type that would nominally be built using the following products:Electrodeposition Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.